Cnc Plasma Vs Laser

Laser cutters and their technology are quickly competing with the cutting speeds of plasma cutters.

Cnc plasma vs laser.

Laser vs cnc mill precision one of the most contributing factors to a laser purchase is the speed compared to a cnc mill. Plasma is the most limited. Plasma table cutters currently have the fastest cutting speed amongst the three options. Not ideal for thinner material worth considering if frequently cutting heavy steel plate.

The cutting slot of the plasma cutting machine is slightly larger than that of the laser cutting machine. A trotec laser is at least twice as fast as a router for most applications. The bottom line for your bottom line when comparing plasma versus laser. Waterjet vs laser vs plasma cutting plasma cutting and water while cut the wire and plasma cutting advantages waterjet in the cnc also edm during blog difference in cutting the news.

Laser cutting machine has faster cutting speed. Cnc fiber laser tables are slightly faster than co2 cutters on all thicknesses. Plasma laser cutting and water plasma cutting while cutting the wire and plasma cutting advantages in the cnc also edm during laser blog difference in the news. Cnc plasma affordable quality fast cutting of most metals with the right equipment oxy suitable only for carbon steel.

Plasma cutting is a more dangerous process than laser cutting yet it is also best at cutting thick materials. Laser is limited to metalics some plastics and fiberglass some fabric. The speed can reach 10m min of laser cutter which is much faster than the plasma cutter. Most cnc plasma cutting machines run at about 15 hour whereas laser cutting machines generally cost around 20 hour to operate.

The aforementioned safety considerations also drive up the cost of operating a laser cutting system since special accommodations must be made. Depending on material thickness plasma can cut up to 200 ipm inches per minute. It can only cut conductive metals and is really only practical for mild steel stainless steel and aluminum.